Forensic characterization of thin film resistor degradationROESCH, William J.Microelectronics and reliability. 2008, Vol 48, Num 7, pp 958-964, issn 0026-2714, 7 p.Conference Paper

Using a new bathtub curve to correlate quality and reliabilityROESCH, William J.Microelectronics and reliability. 2012, Vol 52, Num 12, pp 2864-2869, issn 0026-2714, 6 p.Conference Paper

Compound semiconductor activation energy in humidityROESCH, William J.Microelectronics and reliability. 2006, Vol 46, Num 8, pp 1238-1246, issn 0026-2714, 9 p.Conference Paper

The ROCS Workshop and 25 years of compound semiconductor reliabilityROESCH, William J.Microelectronics and reliability. 2011, Vol 51, Num 2, pp 188-194, issn 0026-2714, 7 p.Conference Paper

Historical review of compound semiconductor reliabilityROESCH, William J.Microelectronics and reliability. 2006, Vol 46, Num 8, pp 1218-1227, issn 0026-2714, 10 p.Conference Paper

Field returns, a source of natural failure mechanismsROESCH, William J; BROCKETT, Steve.Microelectronics and reliability. 2007, Vol 47, Num 8, pp 1156-1165, issn 0026-2714, 10 p.Conference Paper

Separating HBT wearout from defects during early life operationROESCH, William J; RAINS, Philip.Microelectronics and reliability. 2014, Vol 54, Num 2, pp 360-365, issn 0026-2714, 6 p.Conference Paper

Metal defect yield and reliability relationshipsROESCH, William J; HAMADA, Dorothy June M.Microelectronics and reliability. 2005, Vol 45, Num 12, pp 1875-1881, issn 0026-2714, 7 p.Conference Paper

A wafer-level approach to device lifetestingHAMADA, Dorothy June M; ROESCH, William J.Microelectronics and reliability. 2008, Vol 48, Num 7, pp 985-989, issn 0026-2714, 5 p.Conference Paper

Drainage ratio impact on void creation in gold interconnectLITTLETON, Dave; HAMADA, Dorothy June M; ROESCH, William J et al.Microelectronics and reliability. 2011, Vol 51, Num 2, pp 240-245, issn 0026-2714, 6 p.Conference Paper

Introducing a scale structure to correlate quality and reliabilityROESCH, William J; HAMADA, Dorothy June M; LITTLETON, David et al.Microelectronics and reliability. 2012, Vol 52, Num 1, pp 16-22, issn 0026-2714, 7 p.Conference Paper

Studying yield and reliability relationships for metal defectsROESCH, William J; HAMADA, Dorothy June M.ROCS workshop. 2004, pp 121-133, isbn 0-7908-0105-1, 1Vol, 13 p.Conference Paper